Publications

Journal Papers

  1. K. Aihara, M. J. Chen, A-V. Pham, "Reliability of Liquid Crystal Polymer Air Cavity Packaging" IEEE Transactions on Advanced Packaging, 2010, In press.

  2. M. J. Chen, Z. Zhang, A.-V. H. Pham, D. Hyman, "Design and Development of a Broadband Amplitude Compensated Long Time Delay Circuit on Thin-Film Liquid Crystal Polymer," Wiley InterScience Microwave and Optical Technology Letters, Vol. 51, No.4, pp. 1060-1063, April 2009.

  3. K. Aihara, M. J. Chen, A-V. Pham, "Development of Thin-Film Liquid Crystal Polymer Surface Mount Packages for Ka-band Applications" IEEE Transactions on Microwave Theory and Techniques, Vol. 56, No. 9, pp. 2111-2117, September 2008.

  4. M. J. Chen, A-V. Pham, C. Kapusta, J. Iannotti, W. Kornrumpf, N. Evers, J. Maciel, "Multilayer Organic Multi-Chip Module Implementing Hybrid Microelectromechanical Systems" IEEE Transactions on Microwave Theory and Techniques, Vol. 56, No. 4, pp.952-958, April 2008.

  5. A. C. Chen, M. J. Chen, A. Pham, "Development of an RF Ultra-Wide Band Balun in Multi-layer Liquid Crystal Polymer Flex," IEEE Transactions on Advanced Packaging, Vol. 30, No. 3, pp.533-540, August 2007.

  6. M. J. Chen, A-V. Pham, C. Kapusta, J. Iannotti, W. Kornrumpf, N. Evers, J. Maciel, "Design and Development of a Hermetic Package using LCP for RF/Microwave MEMS Switches," IEEE Transactions on Microwave Theory and Techniques, Vol. 54, No. 11, pp.4009-4015, November 2006.

  7. M. Chen, "Single Chip Radio," California Engineer: Student Journal of the UC Engineering Colleges, Vol 82, Issue 3, Spring/Summer 2004: pp. 4-8.

Conference Proceedings

  1. M. J. Chen, S. A. Tabatabaei, "Broadband, Quad Flat No-Lead (QFN) Package Developed using Standard Overmold Leadframe Technology," IEEE MTT-S Int. Microwave Symp. Dig., Anaheim, CA, May 23-28, 2010, In-Press.

  2. M. J. Chen, S. A. Tabatabaei, "Broadband, Thin-Film, Liquid Crystal Polymer Air-Cavity Quad Flat No-Lead (QFN) Package," IEEE Compound Semiconductor IC Symposium Digest, pp. 187-190, Greensboro, NC, October 11-14, 2009.

  3. M. J. Chen, Z. Zhang, A.-V. H. Pham, D. Hyman, "Thin-Film LCP Amplitude Compensated Long Time Delay Circuit," IEEE MTT-S Int. Microwave Symp. Dig., Atlanta, GA, June 15-20, 2008.

  4. A.-V. Pham, K. Aihara, M. Chen, C. Chen, E. Zhang, T. W. Dalrymple, "Performance of Surface Mount LCP Package Environmental Tests," GOMACTech, Las Vegas, NV, March 17-20, 2008.

  5. J. Iannotti, C. Kapusta, W. Taft, A. Jacomb-Hood, M. Chen, A.-V. Pham, "Wideband Passive Amplitude Compensated True Time Delay (TTD) Module for Active Phase Arrays," GOMACTech, Lake Buena Vista, FL, March 19-22, 2007.

  6. M. Chen, N. Evers, C. Kapusta, J. Iannotti, W. Kornrumpf, A.-V. Pham, J. Maciel, N. Karabudak, "Reliability of a Hermetic LCP Package for RF MEMS Switches," GOMACTech, Lake Buena Vista, FL, March 19-22, 2007.

  7. N. Karabudak, J. Iannotti, N. Evers, M. Chen, A.-V. Pham, "Development of Hermetically Sealed for MEMS Modules Using Liquid Crystalline Polymer," 12th Ka and Broadband Communications Conference, Naples, Italy, September 27-29, 2006.

  8. M. Chen, A. Pham, C. Kapusta, J. Iannotti, W. Kornrumpf, N. Evers, J. Maciel, N. Karabudak, "Development of Multilayer Organic Modules for Hermetic Packaging of RF MEMS Circuits," IEEE MTT-S Int. Microwave Symp. Dig., pp. 271-274, San Francisco, CA, June 2006.

  9. C. Tam, C. Chiang, M. Cao, M. Chen, M. C. Wong, J. K. Poon, K. Aihara, A. C. Chen, A. Vazquez, C. D. Johns, J. M. Frei, I. Kimukin, A. K. Dutta, M. S. Islam, "High speed pin photodetector with ultrawide spectral responses", Proc. SPIE Vol. 6014, Issue 1, pp. 291-296, Boston, MA, October 23, 2005.

  10. M. Chen, N. Evers, C. Kapusta, J. Iannotti, A. Pham, W. Kornrumpf, J. Maciel, N. Karabudak, "Development of a Hermetically Sealed Enclosure for MEMS in Chip-on-Flex Modules using Liquid Crystal Polymer (LCP)", Proc. of the ASME Interpack '05, Part C, Page(s): 2057-2060, San Francisco, CA, July 2005

  11. A.C. Chen, M. Chen, A. Pham, "Development of Microwave Ultra-Wide Band Balun using Liquid Crystal Polymer Flex", 55th IEEE Electronic Components and Technology Proceedings, 31 Page(s): 783 - 787, May 2005.