Publications
Books
- A.-V. H. Pham, M. J. Chen, K. Aihara, LCP for Microwave
Packages and Modules,
Cambridge University Press, June 2012.
- M. P. McGrath, K. Aihara, M. J. Chen, C. Chen, A.-V. Pham,
"Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer
Hermetic Packages and Modules," in RF and Microwave Microelectronics
Packaging,
Springer New York, edited by K. Kuang, F. Kim, S. S. Cahill.
2010.
Journal Papers
- K. Aihara, M. J. Chen, C. Chen, A.-V. Pham, "Reliability of
Liquid Crystal Polymer Air Cavity Packaging,"
IEEE Transactions on Components, Packaging and Manufacturing, Vol. 2, No. 2, pp. 224-230, February 2012
- M. J. Chen, Z. Zhang, A.-V. H. Pham, D. Hyman,
"Design and Development of a Broadband Amplitude Compensated Long Time
Delay Circuit on Thin-Film Liquid Crystal Polymer," Wiley
InterScience
Microwave and Optical Technology Letters, Vol. 51, No. 4, pp.
1060-1063, April 2009.
- K. Aihara, M. J. Chen, A-V. Pham,
"Development of Thin-Film Liquid Crystal Polymer Surface Mount Packages for Ka-band Applications,"
IEEE
Transactions
on Microwave Theory and Techniques,
Vol. 56, No. 9, pp. 2111-2117, September 2008.
- M. J. Chen, A-V. Pham, C. Kapusta, J. Iannotti, W. Kornrumpf,
N. Evers, J. Maciel,
"Multilayer Organic Multi-Chip Module Implementing Hybrid
Microelectromechanical Systems," IEEE
Transactions
on Microwave Theory and Techniques, Vol. 56, No. 4, pp.952-958,
April 2008.
- A. C. Chen, M. J. Chen, A. Pham, "Development of an RF
Ultra-Wide Band
Balun in Multi-layer Liquid Crystal Polymer Flex," IEEE
Transactions on Advanced
Packaging, Vol. 30, No. 3, pp.533-540, August 2007.
- M. J. Chen, A-V. Pham, C. Kapusta, J. Iannotti, W. Kornrumpf,
N.
Evers, J. Maciel,
"Design and Development of a Hermetic Package using LCP for
RF/Microwave MEMS Switches," IEEE
Transactions
on Microwave Theory and Techniques, Vol. 54, No. 11, pp.4009-4015,
November
2006.
- M. Chen, "Single Chip Radio," California Engineer: Student
Journal of the UC Engineering Colleges, Vol 82, Issue
3, Spring/Summer 2004: pp. 4-8.
Conference Proceedings
- M. J. Chen, L. Ralph, E. Rodgers, “Analog Predistortion of K-band GaN for 10W Linear Output Power and 30% Power Added Efficiency,” IEEE WAMICON, April 28-29, 2021.
- N. Robbins, D. Eze, H. Cohen, X. Zhai, W. McGeary, W. Menninger, M. Chen, E. Rodgers, “Space Qualified 200-W Q-band Linearized Traveling-Wave Tube Amplifier,” International Vacuum Electronics Conference, Monterey, CA, April 23-26, 2018.
- M. J. Chen, S. A. Tabatabaei, "Broadband, Quad Flat No-Lead (QFN) Package Developed using Standard Overmold Leadframe Technology,"
IEEE MTT-S
Int. Microwave Symp. Dig., pp. 457-460, Anaheim, CA, May 23-28, 2010.
- M. J. Chen, S. A. Tabatabaei, "Broadband, Thin-Film, Liquid
Crystal Polymer Air-Cavity Quad Flat No-Lead (QFN) Package," IEEE Compound Semiconductor IC Symposium Digest, pp. 187-190,
Greensboro, NC, October 11-14, 2009.
- M. J. Chen, Z. Zhang, A.-V. H. Pham, D. Hyman, "Thin-Film LCP
Amplitude Compensated Long Time Delay Circuit," IEEE MTT-S
Int. Microwave Symp. Dig., Atlanta, GA, June 15-20, 2008.
- A.-V. Pham, K. Aihara, M. Chen, C. Chen, E. Zhang, T. W.
Dalrymple,
"Performance of Surface Mount LCP Package Environmental Tests," GOMACTech, Las Vegas, NV, March 17-20,
2008.
- J. Iannotti, C. Kapusta, W. Taft, A. Jacomb-Hood, M. Chen,
A.-V. Pham,
"Wideband Passive Amplitude Compensated True Time Delay (TTD)
Module for Active Phase Arrays," GOMACTech, Lake
Buena Vista, FL, March 19-22, 2007.
- M. Chen, N. Evers, C. Kapusta, J. Iannotti, W. Kornrumpf, A.-V.
Pham,
J. Maciel, N. Karabudak,
"Reliability of a Hermetic LCP Package for RF MEMS Switches,"
GOMACTech, Lake
Buena Vista, FL, March 19-22, 2007.
- N. Karabudak, J. Iannotti, N. Evers, M. Chen, A.-V. Pham,
"Development of
Hermetically Sealed for MEMS Modules Using Liquid Crystalline Polymer," 12th Ka and Broadband Communications Conference,
Naples, Italy, September 27-29, 2006.
- M. Chen, A. Pham, C. Kapusta, J. Iannotti, W. Kornrumpf, N.
Evers, J. Maciel, N. Karabudak,
"Development of Multilayer Organic Modules for Hermetic Packaging of RF
MEMS Circuits,"
IEEE MTT-S
Int. Microwave Symp. Dig., pp. 271-274, San Francisco, CA, June
2006.
- C. Tam, C. Chiang, M. Cao, M. Chen, M. C. Wong, J. K. Poon, K.
Aihara, A. C.
Chen, A. Vazquez, C. D. Johns, J. M. Frei, I. Kimukin, A. K. Dutta, M. S. Islam, "High
speed pin photodetector with ultrawide spectral responses", Proc. SPIE
Vol. 6014, Issue 1, pp. 291-296, Boston, MA, October 23,
2005.
- M. Chen, N. Evers, C. Kapusta, J. Iannotti,
A. Pham, W. Kornrumpf, J. Maciel, N. Karabudak, "Development of a
Hermetically Sealed Enclosure for MEMS in Chip-on-Flex Modules using
Liquid Crystal Polymer (LCP)", Proc. of the ASME
Interpack '05, Part C, Page(s): 2057-2060, San Francisco, CA, July
2005
- A.C. Chen, M. Chen, A. Pham, "Development of Microwave
Ultra-Wide Band
Balun using Liquid Crystal Polymer Flex", 55th
IEEE
Electronic Components and Technology
Proceedings, 31 Page(s): 783 - 787, May 2005.
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