Morgan's FactsheetBiographical Sketch:Morgan J. Chen (S'00,M'03,SM'13) received his B.S. in electrical engineering and computer science (EECS) from the University of California at Berkeley, in 2003. He received his Ph.D. in electrical and computer engineering from the University of California, Davis in 2008. In the summer of 2001, he was an Engineer at Boeing Autometric, Inc., in San Diego, CA. In the summer of 2002, he conducted research on a multiband/multimode transmitter at Clemson University, Clemson, SC, which was sponsored by the National Science Foundation (NSF). In the summers of 2004 and 2005, he conducted research in MEMS circuit design and integration on multilayer flex at General Electric Global Research (GEGR), Niskayuna, NY. From 2003 to 2008, he conducted research at the University of California, Davis developing novel wafer-level/chip-scale packaging (WLCSP) and RF MEMS circuit designs using Liquid Crystal Polymer (LCP). From 2008 to 2010, he was a Sr. Design Engineer for Endwave Corporation R&D where he developed MMICs and novel, low-cost broadband packages operating from DC to past 60 GHz. From 2010 to 2015, he was with Futurewei Technologies, a wholly owned R&D subsidiary of Huawei Technologies. From 2015 to 2017, he had been a Principal Engineer with Nokia Technologies and Lead Engineer with Nokia Networks. From 2017 to 2021, he was Director of Advanced Technology and Product Development with L3Harris Technologies (Narda Microwave-West) running the Linearizer and Amplifier design group. From 2021 to 2023, he was Director of Advanced Development and Electrical Engineering with Lucix Corporation overseeing the Solid-State Power Amplifier (SSPA) product line. Since 2024, he managed the Quantum Sensor group at Northrop Grumman with major research thrusts in atomic clocks, Ryberg atoms, and NMR magnetometers for future Positioning, Navigation, and Timing. He has authored or coauthored over 15 peer-reviewed journal and conference papers, 1 book chapter, and 1 book. His research interests include low-cost RF/microwave packaging implementation, optical networking, MEMS, and circuit design. Dr. Chen is a senior member of the Institute of Electrical and Electronics Engineers (IEEE) Microwave Theory and Techniques Society (MTT-S). He currently serves on Editorial Review Boards for IEEE Transactions on Microwave Theory and Techniques (TMTT) and IEEE Microwave and Wireless Component Letters (MWCL). He has also served on Technical Program Review Committees (TPRC) for the Asia Pacific Microwave Conference (APMC) in 2009 and International Microwave Symposia (IMS) 2011 and 2012. He is a Life Member of the electrical engineering honor society Eta Kappa Nu (HKN). Education:
Miscellaneous
Collegiate Studies During my undergraduate studies from 1999-2003 in Electrical Engineering and Computer Science (EECS) at University of California, Berkeley,
High School
Hobbies
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